AMB (Active Metal Brazing) is a technology competing with DBC, where a thick copper layer (from 150 to 400 μm) is soldered with active solder, able to wet ceramics and metal.Having all the benefits of DBC, AMB substrates have important additional advantages, which allows them to be used in products with high operational requirements. The use of AMB substrates becomes an ideal solution if it is necessary to carry out high-temperature soldering in an H2 medium and extreme thermal and energy cycle resistance is required.