Ceramic substrates and components.– Main materials: Al2O3, AlN, Si3N4, TiBaO3, systems based on Mg-Si, Mg-Ti, Mg-Ca, etc.;– Laser processing (cutting, scribing, profiling, ablation);– Diamond processing (cutting and profiling);– Grinding and polishing;– Hole drilling (including coneless), half-holes, slots, etc .;– Any geometric design of the workpiece profile.–