DBC technology (Direct Bond Copper) is a technology using thick copper foil (0.125-0.7 mm), which is clad on aluminum oxide or nitride. Thick copper conductors provide excellent conductivity and heat dissipation from semiconductor power crystals.Due to their excellent characteristics, DBC boards are indispensable for full-fledged operation with currents over 50A and voltages up to 20kV, as well as their effective cooling.