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CÓDIGO DEL PRODUCTO (HS 2017)
845611
Machine-tools; for working any material by removal of material; operated by laser
Installation laser cutting of semiconductor wafers RT-350
DESCRIPTION
Designed for seamless sharing plates of semiconductor materials in the chips by the method of laser managed thermosplitting (LUT).LOOT method allows you to divide the semiconductor wafer into chips with high performance with zero width cutting without release of vapour and particles of material. The advantages of this method of cutting in the first place include: high cutting speed; high dimensional accuracy when cutting; the lowest energy intensity of the laser process; managed thermosplitting in comparison with other known methods of cutting; high process purity based on non-waste separation process; zero width of cut; increasing twice the mechanical strength of the resulting products compared to other traditional methods of cutting; the ability to fully automate the process of dimensional cutting.